{"$schema": "https://iptc.org/std/ninjs/ninjs-schema_3.2.json", "uri": "urn:newsml:wireva.mib.news:item:5a528ec1-a132-4c17-83de-9035f3ce4bf5", "type": "text", "profile": "standard", "version": "1", "versioncreated": "2026-11-03T17:45:36.860368Z", "firstcreated": "2026-11-03T17:45:09.739182Z", "pubstatus": "usable", "urgency": 5, "language": "en", "headline": "SEMICON Europa 2026 in Munich to showcase chip R&D and product innovation", "byline": "Kelsey Sawyer", "located": "United States", "copyrightholder": "Haydamax OÜ", "copyrightnotice": "Wireva / Science Official", "usageterms": "Monitoring item. Headline, short extract and the source link may be shown. Do not republish the full text.", "description_text": "The SEMICON Europa 2026 trade event, held in Munich from November 10 to 13, will bring together semiconductor professionals and exhibitors to present new equipment and manufacturing technologies, with precision positioning and metrology among the highlighted areas.", "altids": {"mosaic": "5a528ec1-a132-4c17-83de-9035f3ce4bf5", "story": "ef933965-30f6-4575-bfc4-13cc8a852979", "slug": "semicon-europa-2026-in-munich-to-showcase-chip-r-d-and-product-innovation"}, "subject": [{"name": "Technology", "rel": "direct", "literal": "technology", "code": "medtop:13000000", "scheme": "http://cv.iptc.org/newscodes/mediatopic/", "uri": "http://cv.iptc.org/newscodes/mediatopic/13000000"}], "place": [{"name": "United States", "literal": "us", "code": "US", "scheme": "http://cv.iptc.org/newscodes/countrycodes/"}], "person": [], "organisation": [], "genre": [{"name": "Standard story", "literal": "standard"}], "service": [{"name": "Wireva", "literal": "wireva"}], "body_text": "The SEMICON Europa 2026 trade event, held in Munich from November 10 to 13, will bring together semiconductor professionals and exhibitors to present new equipment and manufacturing technologies, with precision positioning and metrology among the highlighted areas.", "extra_body_note": "Extract only — see rights.class = link_only.", "associations": {"featuremedia": {"uri": "urn:newsml:wireva.mib.news:media:f872ef9d-a4ae-487d-b1a4-b7f351e2c7fe", "type": "picture", "version": "1", "pubstatus": "usable", "headline": "SEMICON Europa 2026 showcases semiconductor R&D and product innovation", "description_text": "SEMICON Europa 2026 in Munich to showcase chip R&D and product innovation", "copyrightholder": "physicsworld.com", "copyrightnotice": "SEMICON Europa 2026 showcases semiconductor R&D and product innovation", "usageterms": "Picture belongs to the source publication: address and terms are delivered, the file is not.", "altids": {"wireva": "f872ef9d-a4ae-487d-b1a4-b7f351e2c7fe"}, "extra": {"wireva:delivery_mode": "link_only", "wireva:rights": {"licence": "", "licence_url": "", "licence_raw": "RSS source", "licence_verified_at": "2026-11-03T17:45:36.887437Z", "attribution_required": true, "attribution_text": "SEMICON Europa 2026 showcases semiconductor R&D and product innovation", "redistribution_allowed": false, "commercial_use_allowed": false, "modifications_allowed": false, "share_alike_required": false}, "wireva:provenance": {"creator": "", "source_name": "physicsworld.com", "source_url": "https://physicsworld.com/wp-content/uploads/2026/10/smaract-wafer-stage-01-11-2026.jpg", "source_page_url": "https://physicsworld.com/wp-content/uploads/2026/10/smaract-wafer-stage-01-11-2026.jpg", "our_page_url": "https://scienceofficial.org/technology/semicon-europa-2026-in-munich-to-showcase-chip-r-d-and-product-innovation/"}, "wireva:role": "lead"}, "renditions": {"source": {"href": "https://physicsworld.com/wp-content/uploads/2026/10/smaract-wafer-stage-01-11-2026.jpg", "mimetype": "image/jpeg"}}}}, "extra": {"wireva:story": {"uri": "urn:newsml:wireva.mib.news:story:ef933965-30f6-4575-bfc4-13cc8a852979", "slug": "semicon-europa-2026-in-munich-to-showcase-chip-rd-and-product-innovation-20261103", "status": "developing", "languages": ["en"], "item_count": 1, "is_breaking": false}, "wireva:rights": {"class": "link_only", "redistribution_allowed": false, "commercial_use_allowed": false, "modifications_allowed": true, "share_alike_required": false, "attribution_required": true, "attribution_text": "Wireva / Science Official", "canonical_required": true, "canonical_url": "https://scienceofficial.org/technology/semicon-europa-2026-in-munich-to-showcase-chip-r-d-and-product-innovation/", "linkback_required": true, "licence": "", "licence_url": "", "licensor": "Haydamax OÜ", "valid_until": null, "excerpt_max_chars": 280, "decided_by_rule": "derivation_failed", "needs_review": true}, "wireva:provenance": {"production_method": "automated", "ai_stages": {"editing": true, "drafting": true, "headline": true, "discovery": true, "classification": true, "image_selection": true, "source_collection": true, "cross_source_comparison": true}, "model": "", "human_reviewed": false, "reviewed_by": "", "reviewed_at": null, "editorial_control": true, "editorial_responsibility": "Haydamax OÜ (Wireva)", "factchecked": false, "verification_status": "single_source", "independent_confirmations": 0, "official_source_used": false, "used_press_release": false, "public_interest": false, "ai_disclosure_required": false, "ai_disclosure_text": "", "independence_check": {"status": "failed", "score": 0.793, "checked_at": "2026-11-03T17:45:36.881750Z"}}, "wireva:publication": {"name": "Science Official", "domain": "scienceofficial.org", "country": "US", "url": "https://scienceofficial.org/technology/semicon-europa-2026-in-munich-to-showcase-chip-r-d-and-product-innovation/"}, "wireva:links": {"self": "https://wireva.mib.news/api/v1/items/5a528ec1-a132-4c17-83de-9035f3ce4bf5", "html": "https://wireva.mib.news/item/5a528ec1-a132-4c17-83de-9035f3ce4bf5/semicon-europa-2026-in-munich-to-showcase-chip-r-d-and-product-innovation/", "story": "https://wireva.mib.news/story/semicon-europa-2026-in-munich-to-showcase-chip-rd-and-product-innovation-20261103/"}, "wireva:metrics": {"word_count": 389, "char_count": 2774, "reading_time_seconds": 198}}}