{"$schema": "https://iptc.org/std/ninjs/ninjs-schema_3.2.json", "uri": "urn:newsml:wireva.mib.news:story:32e3b0e5-60df-406b-b69d-5f7fc39a3008", "type": "composite", "version": "1", "versioncreated": "2026-09-17T07:03:33.750193Z", "firstcreated": "2026-09-17T07:03:23.961450Z", "pubstatus": "usable", "language": "uk", "headline": "Японія та США обговорюють будівництво заводу мікросхем у межах інвестиційної угоди на $550 млрд", "description_text": "Токіо та Вашингтон ведуть переговори про створення спільного підприємства з виробництва напівпровідників на території США в рамках масштабної інвестиційної домовленості обсягом $550 млрд, повідомляє Nikkei.", "associations": {"item-0": {"$schema": "https://iptc.org/std/ninjs/ninjs-schema_3.2.json", "uri": "urn:newsml:wireva.mib.news:item:6d9e1617-4933-4315-aca1-bccc60093f56", "type": "text", "profile": "standard", "version": "1", "versioncreated": "2026-09-17T07:07:17.811216Z", "firstcreated": "2026-09-17T07:03:23.961450Z", "pubstatus": "usable", "urgency": 5, "language": "uk", "headline": "Японія та США обговорюють будівництво заводу мікросхем у межах інвестиційної угоди на $550 млрд", "byline": "Зоряна Яремчук", "located": "Ukraine", "copyrightholder": "Haydamax OÜ", "copyrightnotice": "Wireva / Карторг", "usageterms": "Subscribers may republish this item in full, including translation and trimming, with the credit “Wireva / Карторг”. Set rel=canonical to https://cartorg.com.ua/tekhnologii/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/ when publishing on the web.", "description_text": "Токіо та Вашингтон ведуть переговори про створення спільного підприємства з виробництва напівпровідників на території США в рамках масштабної інвестиційної домовленості обсягом $550 млрд, повідомляє Nikkei.", "altids": {"mosaic": "6d9e1617-4933-4315-aca1-bccc60093f56", "story": "32e3b0e5-60df-406b-b69d-5f7fc39a3008", "slug": "iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd"}, "subject": [{"name": "Economy and business", "rel": "direct", "literal": "economy", "code": "medtop:04000000", "scheme": "http://cv.iptc.org/newscodes/mediatopic/", "uri": "http://cv.iptc.org/newscodes/mediatopic/04000000"}], "place": [{"name": "Ukraine", "literal": "ua", "code": "UA", "scheme": "http://cv.iptc.org/newscodes/countrycodes/"}], "person": [], "organisation": [], "genre": [{"name": "Standard story", "literal": "standard"}], "service": [{"name": "Wireva", "literal": "wireva"}], "associations": {"featuremedia": {"uri": "urn:newsml:wireva.mib.news:media:c25f1901-c4f9-43ec-a3e7-0e41e5d50cd6", "type": "picture", "version": "1", "pubstatus": "usable", "headline": "Japan, U.S. discuss building chip plant under $550 bln investment deal- Nikkei", "description_text": "Японія та США обговорюють будівництво заводу мікросхем у межах інвестиційної угоди на $550 млрд", "copyrightholder": "commons.wikimedia.org", "copyrightnotice": "william craig", "usageterms": "Open licence: the credit line must travel with the file.", "altids": {"wireva": "c25f1901-c4f9-43ec-a3e7-0e41e5d50cd6"}, "extra": {"wireva:delivery_mode": "file", "wireva:rights": {"licence": "CC BY-SA 2.0", "licence_url": "https://creativecommons.org/licenses/by-sa/2.0/", "licence_raw": "CC BY-SA 2.0", "licence_verified_at": "2026-09-17T07:07:17.823222Z", "attribution_required": true, "attribution_text": "william craig", "redistribution_allowed": true, "commercial_use_allowed": true, "modifications_allowed": true, "share_alike_required": true}, "wireva:provenance": {"creator": "", "source_name": "commons.wikimedia.org", "source_url": "https://commons.wikimedia.org/wiki/File:National_Semiconductor_Factory_-_geograph.org.uk_-_63468.jpg", "source_page_url": "https://commons.wikimedia.org/wiki/File:National_Semiconductor_Factory_-_geograph.org.uk_-_63468.jpg", "our_page_url": "https://cartorg.com.ua/tekhnologii/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/"}, "wireva:role": "lead"}, "renditions": {"original": {"href": "https://nbg1.your-objectstorage.com/ckln/image-assets/6c730bb80f50b3708bb30951da9287742be9d56633f3714a156c128cee469754.jpg", "mimetype": "image/jpeg", "width": 640, "height": 480, "sizeinbytes": 90232}, "source": {"href": "https://commons.wikimedia.org/wiki/File:National_Semiconductor_Factory_-_geograph.org.uk_-_63468.jpg", "mimetype": "image/jpeg"}}}}, "extra": {"wireva:story": {"uri": "urn:newsml:wireva.mib.news:story:32e3b0e5-60df-406b-b69d-5f7fc39a3008", "slug": "550-20260917", "status": "updated", "languages": ["uk"], "item_count": 2, "is_breaking": false}, "wireva:rights": {"class": "agency_original", "redistribution_allowed": true, "commercial_use_allowed": true, "modifications_allowed": true, "share_alike_required": false, "attribution_required": true, "attribution_text": "Wireva / Карторг", "canonical_required": true, "canonical_url": "https://cartorg.com.ua/tekhnologii/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/", "linkback_required": true, "licence": "Wireva subscriber licence", "licence_url": "", "licensor": "Haydamax OÜ", "valid_until": null, "excerpt_max_chars": 0, "decided_by_rule": "agency_original_unassessed_allow", "needs_review": true}, "wireva:provenance": {"production_method": "automated", "ai_stages": {"editing": true, "drafting": true, "headline": true, "discovery": true, "classification": true, "image_selection": true, "source_collection": true, "cross_source_comparison": true}, "model": "", "human_reviewed": false, "reviewed_by": "", "reviewed_at": null, "editorial_control": true, "editorial_responsibility": "Haydamax OÜ (Wireva)", "factchecked": false, "verification_status": "single_source", "independent_confirmations": 0, "official_source_used": false, "used_press_release": false, "public_interest": true, "ai_disclosure_required": true, "ai_disclosure_text": "Матеріал підготовлено за допомогою ШІ під редакційною відповідальністю Haydamax OÜ.", "independence_check": {"status": "not_assessed", "score": 0.0, "checked_at": "2026-09-17T07:07:17.820838Z"}, "sources": [{"url": "https://www.investing.com/news/stock-market-news/japan-us-discuss-building-chip-plant-under-550-bln-investment-deal-nikkei-4904869", "title": "Japan, U.S. discuss building chip plant under $550 bln investment deal- Nikkei", "publisher": "investing.com", "type": "rss", "role": "primary", "official": false, "retrieved_at": "2026-09-17T07:07:17.814459Z", "published_at": "2026-09-17T05:45:10Z"}]}, "wireva:publication": {"name": "Карторг", "domain": "cartorg.com.ua", "country": "UA", "url": "https://cartorg.com.ua/tekhnologii/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/"}, "wireva:links": {"self": "https://wireva.mib.news/api/v1/items/6d9e1617-4933-4315-aca1-bccc60093f56", "html": "https://wireva.mib.news/item/6d9e1617-4933-4315-aca1-bccc60093f56/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/", "story": "https://wireva.mib.news/story/550-20260917/"}, "wireva:metrics": {"word_count": 159, "char_count": 1272, "reading_time_seconds": 91}}}, "item-1": {"$schema": "https://iptc.org/std/ninjs/ninjs-schema_3.2.json", "uri": "urn:newsml:wireva.mib.news:item:1d078b5a-ab6f-4910-8b8f-2852cc71dd60", "type": "text", "profile": "standard", "version": "1", "versioncreated": "2026-09-17T07:07:17.838538Z", "firstcreated": "2026-09-17T07:03:33.750193Z", "pubstatus": "usable", "urgency": 5, "language": "uk", "headline": "Японія та США обговорюють будівництво заводу мікросхем у межах інвестиційної угоди на $550 млрд", "byline": "Вікторія Черненко", "located": "Ukraine", "copyrightholder": "Haydamax OÜ", "copyrightnotice": "Wireva / Контрактова", "usageterms": "Subscribers may republish this item in full, including translation and trimming, with the credit “Wireva / Контрактова”. Set rel=canonical to https://kontraktova.com/ekonomika/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/ when publishing on the web.", "description_text": "Японія та США ведуть переговори про будівництво спільного заводу з виробництва напівпровідників у рамках масштабної інвестиційної угоди на $550 млрд. Проєкт покликаний зміцнити технологічний суверенітет союзників та зменшити залежність від азійських ланцюгів постачання.", "altids": {"mosaic": "1d078b5a-ab6f-4910-8b8f-2852cc71dd60", "story": "32e3b0e5-60df-406b-b69d-5f7fc39a3008", "slug": "iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd"}, "subject": [{"name": "Economy and business", "rel": "direct", "literal": "economy", "code": "medtop:04000000", "scheme": "http://cv.iptc.org/newscodes/mediatopic/", "uri": "http://cv.iptc.org/newscodes/mediatopic/04000000"}], "place": [{"name": "Ukraine", "literal": "ua", "code": "UA", "scheme": "http://cv.iptc.org/newscodes/countrycodes/"}], "person": [], "organisation": [], "genre": [{"name": "Standard story", "literal": "standard"}], "service": [{"name": "Wireva", "literal": "wireva"}], "associations": {"featuremedia": {"uri": "urn:newsml:wireva.mib.news:media:bf7b651e-95dc-4e39-9413-ae6c2996de92", "type": "picture", "version": "1", "pubstatus": "usable", "headline": "Japan, U.S. discuss building chip plant under $550 bln investment deal- Nikkei", "description_text": "Японія та США обговорюють будівництво заводу мікросхем у межах інвестиційної угоди на $550 млрд", "copyrightholder": "commons.wikimedia.org", "copyrightnotice": "Intel Free Press", "usageterms": "Open licence: the credit line must travel with the file.", "altids": {"wireva": "bf7b651e-95dc-4e39-9413-ae6c2996de92"}, "extra": {"wireva:delivery_mode": "file", "wireva:rights": {"licence": "CC BY 2.0", "licence_url": "https://creativecommons.org/licenses/by/2.0/", "licence_raw": "CC BY 2.0", "licence_verified_at": "2026-09-17T07:07:17.849444Z", "attribution_required": true, "attribution_text": "Intel Free Press", "redistribution_allowed": true, "commercial_use_allowed": true, "modifications_allowed": true, "share_alike_required": false}, "wireva:provenance": {"creator": "", "source_name": "commons.wikimedia.org", "source_url": "https://commons.wikimedia.org/wiki/File:Leak_Detection_Machine.jpg", "source_page_url": "https://commons.wikimedia.org/wiki/File:Leak_Detection_Machine.jpg", "our_page_url": "https://kontraktova.com/ekonomika/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/"}, "wireva:role": "lead"}, "renditions": {"original": {"href": "https://nbg1.your-objectstorage.com/ckln/image-assets/5e9ea667b6199c0b25fb6326fcb1f0fe0188575adfcd27392f72eb7ecb62832a.jpg", "mimetype": "image/jpeg", "width": 619, "height": 900, "sizeinbytes": 75397}, "source": {"href": "https://commons.wikimedia.org/wiki/File:Leak_Detection_Machine.jpg", "mimetype": "image/jpeg"}}}}, "extra": {"wireva:story": {"uri": "urn:newsml:wireva.mib.news:story:32e3b0e5-60df-406b-b69d-5f7fc39a3008", "slug": "550-20260917", "status": "updated", "languages": ["uk"], "item_count": 2, "is_breaking": false}, "wireva:rights": {"class": "agency_original", "redistribution_allowed": true, "commercial_use_allowed": true, "modifications_allowed": true, "share_alike_required": false, "attribution_required": true, "attribution_text": "Wireva / Контрактова", "canonical_required": true, "canonical_url": "https://kontraktova.com/ekonomika/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/", "linkback_required": true, "licence": "Wireva subscriber licence", "licence_url": "", "licensor": "Haydamax OÜ", "valid_until": null, "excerpt_max_chars": 0, "decided_by_rule": "agency_original_unassessed_allow", "needs_review": true}, "wireva:provenance": {"production_method": "automated", "ai_stages": {"editing": true, "drafting": true, "headline": true, "discovery": true, "classification": true, "image_selection": true, "source_collection": true, "cross_source_comparison": true}, "model": "", "human_reviewed": false, "reviewed_by": "", "reviewed_at": null, "editorial_control": true, "editorial_responsibility": "Haydamax OÜ (Wireva)", "factchecked": false, "verification_status": "single_source", "independent_confirmations": 0, "official_source_used": false, "used_press_release": false, "public_interest": true, "ai_disclosure_required": true, "ai_disclosure_text": "Матеріал підготовлено за допомогою ШІ під редакційною відповідальністю Haydamax OÜ.", "independence_check": {"status": "not_assessed", "score": 0.0, "checked_at": "2026-09-17T07:07:17.847227Z"}, "sources": [{"url": "https://www.investing.com/news/stock-market-news/japan-us-discuss-building-chip-plant-under-550-bln-investment-deal-nikkei-4904869", "title": "Japan, U.S. discuss building chip plant under $550 bln investment deal- Nikkei", "publisher": "investing.com", "type": "rss", "role": "primary", "official": false, "retrieved_at": "2026-09-17T07:07:17.841526Z", "published_at": "2026-09-17T05:45:10Z"}]}, "wireva:publication": {"name": "Контрактова", "domain": "kontraktova.com", "country": "UA", "url": "https://kontraktova.com/ekonomika/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/"}, "wireva:links": {"self": "https://wireva.mib.news/api/v1/items/1d078b5a-ab6f-4910-8b8f-2852cc71dd60", "html": "https://wireva.mib.news/item/1d078b5a-ab6f-4910-8b8f-2852cc71dd60/iaponiia-ta-ssha-obgovoriuiut-budivnitstvo-zavodu-mikroskhem-u-mezhakh-investitsiinoi-ugodi-na-550-mlrd/", "story": "https://wireva.mib.news/story/550-20260917/"}, "wireva:metrics": {"word_count": 376, "char_count": 2929, "reading_time_seconds": 209}}}}, "extra": {"wireva:languages": ["uk"], "wireva:status": "updated", "wireva:item_count": 2}}